Chemsure SPE08 is a paste adhesive which flows like solder when curing. It is designed to provide maximum resistance to impact, shear, cleavage and tensile loads. The durability, chemical resistance and high temperature performance are the best available. SPE08 will bond to a wide variety of substrates, including oily steel, and performance is usually limited by the strength of the substrates. In suitable applications it can replace traditional fixing techniques to give enhanced appearance and greater design flexibility.